Semiconductor Encapsulating Mold Cleaning Sheets

Mold-cleaning sheets that are made of rubber and excel in workability and cleaning ability.

Outline

Transfer molding is the most common method of using the resin to encapsulate semiconductors.  With continuous molding, however, the resin stain remains on the mold die, due to the oxidation of the resin constituents on the mold die, which could cause less releasability of the resin or inferior appearance of the device.  Nitto Denko Cleaning Sheet (NCS) made of non-vulcanized rubber bonds with the resin stains when it is pressurized and recover the releasability of the mold dies.

Features

• Can be used immediately on the molding condition in use without preheating
• Excellent workability
• Easy to detach.  Only to peal off after heat molding, filling up all over the cavities that does not require dummy lead frames or any other cleaning materials.
• Superior cleaning function is manifested in excellent removability of contaminants.