Molding Compound 'MP series', Semiconductor Encapsulating Epoxy Resin

Encapsulating resin protests delicate semiconductor devices. Clean Tablet that improves the operation environment is also available.

Outline

These are molding resin for packing semiconductor devices.  They meet the requirements for semiconductor such as speed, integration, and low-cost by providing a high workability and reliability of packing material with stable quality.  These materials are palletized into tablet that contains the filler of highly pure epoxy resin and other admixtures.  In particular, Clean Tablet method improves the quality with minimizing air bubbles as molding or tablet cracks, and contributes to clean environment by reducing fine power.  In other general-purpose fields, we have constantly developed new concepts ; high-grade MP-7400 Series, HC-100 Series for BGA package, and Underfill material for Flip Chip package.

Structure