Molding Compound

Our world class encapsulating materials excel at protecting highly sensitive semiconductor devices. Semiconductor encapsulating materials are one of the key materials in the composition of semiconductors. These materials are epoxy based resins specially formulated for packaging highly delicate semiconductor devices for protection from heat, shock, humidity, chemicals, and corrosion.

Nitto Denko molding compounds have unique chemical and physical properties that have made our resins very attractive to a wide array of customers in various electronic applications. Our encapsulating materials are manufactured with thorough consideration for ease of handling, excellent mold-ability, efficient process-ability, and achieve remarkable levels of reliability.

Nitto Denko also offers a variety of clear epoxy resins for transparent encapsulation of optical-semiconductor devices such as LEDs, various optical sensors and other optical devices.