NEL-H series of peeling machines for protective tape for backgrind process

Peeling machines for removing protective tape following the backgrind process.

Outline

Following completion of the backgrind process, the ELEP holder protecting the wafer surface is removed using release ELEP holder (BT-315).

Lineup

[HSA-840]

Semi-automatic compact machine for removal of protective ELEP holder. ø4", 5", 6"or 8" wafers can be handled by exchanging the table, and a single push of a button enables automatic tape peeling and winding of remaining tape.

[HR-8500-II robot handling type]

Robotic hands are used to carry the wafers, for the transfer of large diameter wafers up to ø8"without emitting any dust. As options, the mounting of ultraviolet irradiating equipment or combined use with a grinder are possible, and we provide the necessary software system upgrades for this purpose.

Specification

Model		HSA-840	HR-8500-II
Applicable wafer size (diam.)	4"	Capable	Applicable
	5"	Capable
	6"	Capable
	8"	Capable
Applicable ELEP HOLDER		BT-150E serie BT-315 serie	BT-150 serie BT-315 serie
Capacity		100 wafers/hr (Varies depending on manual processing time)	80 wafers/hr (8"wafers)
Power supply /Air supply		Single-phase 100V AC,1kWï Nomal operation 0.49MPa or higher
Equipment dimensions (mm)		W445×D485×H725	W1,020×D940×H1,550 (Line height 900mm)
Weight		45kg	450kg

Option
Generation software for daily operating efficiency report