Tape ELEP holder for the protection or fixing of semiconducting wafers in the dicing process

Actively used in the dicing process. A tape used for protection or temporary holding of wafers, able to handle chips of any size.

ELEP holder for the backgrind process

Outline

The semiconductor industry continues to make ever-more high-level advances. In order to support the manufacturing processes in this rapidly developing industry, Nitto Denko provides the tape 'ELEP holder' for the protection and fixing of semiconducting wafers, and the 'NEL series' of automatic ELEP holder affixing equipment as a system.

Lineup

Model	Type	Product name
Nun UV	Expand type	V-8, V-12, V-15, VD Series
Nun UV	Non-expand type	P-2160
UV curing	Expand type	UE-10, 100, 1000 Series
	For environmental issue	DU-165 (Under designing)
	Non-expand type	UE-2000, 3000 Series
UV curing for special substrate	For glass substrate	NBD-1200X
	For resin substrate	NBD-2000ÅA5000 Series
	For anti-statics	NBD-6172K (Under development)

General Properties

Nun UV (low adnesion type)

Properties

Unit

VD-
8

VD-
15

V-
8-L

V-
15-L

V-
8-M

V-
15-M

V-
8-S

V-
12-S

V-
8-T

V-
12-T

P-
2160

Base

Materiak

PVC

Color

Light blue

Transparent

Light blue

Trans
- parent

Thickness
*a

Total

µm

155

110

160

Base

145

100

150

Adnesive

Adnesive strength
*b

to si mirror wafer

N/20
mm

0.9

2.0

0.5

0.8

1.8

1.0

1.1

0.6

2.0

Expandability
(5mm·)*c

µm

300

350

None

Applicable
chip
size
(In case of
full sutting)*d

0.5

•

0.6

•

0.7

•

0.8

•

0.9

•

Remark

or glass

sample available

production

*a 1/1000 D Dial Thickness gauge
*b 90°peeling, peeling speed : 300mm/min.(23°C)
*c By NEC Machinery Die Bonder,CPS-100 The condition : 9mm push down, 20mm full cut, 35µm blade
*d *c and needle push up speed : 10mm/sec. (4 needles)
*The technical data presented here are typical values only and should not be used for any specification purposes.

UV curing (mainly Si wafer)

Properties

Unit

UE
-10

UE-
1081
G-T

UE-
1085
GX

UE-
111
AJ

UE-
110
BJ

UE-
115
AJ

DU-
165

UE-
2091
J

UE-
2092
J

UE-
3076
H

Backing type

Expand type

Non-expand type

Base

Materiak

PVC

Non

PVC

type

Color

Trans parent

Light blue

Transparent

Thickness *a

Total

µm

120

107

101

150

105

Base

100

140

100

Adnesive

Adnesive strength
*b
to si mirror wafer

Befor
UV irradiation

N/20 mm

3.92

1.18

8.33

7.50

9.80

3.10

8.33

8.30

1.96

After UV irradiation

0.20

0.10

0.29

0.20

0.22

0.20

0.05

0.06

0.29

Applicable
chip size
(In case of full sutting)*c

0.4

•

0.5

•

0.6

•

0.7

•

0.8

•

0.9

•

Remark

Less chipping at back side

Non PVC expand type

sample
available

Under develop
-ment

production

*a 1/1000 D Dial Thickness gauge
*b 90°peeling, peeling speed : 300mm/min.(23°C) UV irradiation condition : 460mj/cm2
*c By NEC Machinery Die Bonder,CPS-100
The condition : 9mm push down, 20mm full cut, 35µm blade
Needle push up speed : 10mm/sec. (4 needles)
*The technical data presented here are typical values only and should not be used for any specification purposes.

UV curing (for special substrate)

Properties		Unit	NBD- 1200X	NBD- 5170K	NBD- 5172K	NBD- 2170K	NBD- 2172K	NBD- 5232K	NBD- 6172K
Backing type			Glass substrate	m-BGA dicing
Base	Materiak		PVC	PO		PE		PO
	Color		Opaque			White		Opaque	Light grey
Thickness *a	Total	µm	190	170				230	170
	Base		185	150				210	150
	Adnesive		5	20
Adnesive strength*b to si mirror wafer	Befor UV irradiation	N/20mm	5.3	14.7	9.00	14.7	8.00	9.00	8.50
	After UV irradiation		0.37	0.15	0.22	0.15	0.22	0.22	0.2
Remark			Less chipping	-					Antistatics
sample available		-	OK						Please contact Nitto window person.
production		-	OK						-

*a 1/1000 D Dial Thickness gauge
*b 90°peeling, peeling speed : 300mm/min.(23°C) UV irradiation condition : 460mj/cm2
*The technical data presented here are typical values only and should not be used for any specification purposes.