Tape ELEP holder for protection or fixing of semiconducting wafers in the backgrind process

Wafer protection/fixing tape for use during the backgrind process, suitable for any kind of wafer.

Outline

This tape for the protection or fixing of wafers boasts excellent characteristics and high reliability. It is produced in a clean environment of the highest level, and the line-up has been prepared to offer a variety of types differentiated by substrate, thickness and adhesive used.

Lineup

Product name	Features	Key point
A, AL, ALK series	Initial type	Weak adhesion
BLK, BK series	Water-sealing type	Good follow over uneven surfaces like gold bumps and ink dots.
CM series	•Weakly sticks to polyimde-coated wafers, therefore tape readily peels.  (Low stick, easy peel type) • Adhesive transferred to silicon wafers is easily removed with water. • Accurately controlled tape thickness improves finish precision after backgrinding.	Easily peeled off from adherends like bumps and ink dots.
DL series	• Adhesive transferred to silicon wafers is easily removed with water.   • Low particle count.   • Accurately controlled tape thickness improves finish precision after backgrinding.	Effective with nonpolyimide wafers like gold bumps and ink dots
EL series	•Stable adhesive strength.  Can be attached to all kinds of wafers: silicon, polyimide--coated, aluminum-deposited, etc.   •Extremely low glue transfer to silicon wafer.   • Accurately controlled tape thickness improves finish precision after backgrinding.	Silicon-free separator specification
FL series	• High adhesive strength has sealing effect against water penetration.  (High stick, easy peel type) • Adhesive transferred to silicon wafers is easily removed with water. • Accurately controlled tape thickness improves finish precision after backgrinding.	High cohesion polymer used as glue
KL series	Low stain, high stick and easy peel	No water washing type

General Properties

Product no.		BT- 150E-AL	BT- 150E-BLK	BT- 150E-CM	BT- 150E-DL	BT- 150E-EL	BT- 150E-FL
Thickness(µm) *1	Total	150			145	150
	Base	135
	Adhesive	15			10	15
Adnesive strength (N/20mm) *2	to Si wafer	0.70	0.80	0.20	0.40	0.75	1.50
	to PI coated wafer	2.10	2.15	0.45	2.45	1.20	2.20
	to AL evaporated wafer	3.65	3.15	0.55	3.05	1.05	2.00
Number of particle 0.28µm< (number/4"wafer) *3		32	34	38	7	25	15
Impurity (p.p.m=µg/g) *4	Na+	0.30	0.25	0.35	0.30	0.10	0.20
	K+	ND(<0.10)
	Cl-	0.35	0.40	0.30	0.35	0.10

*1   1/1000 dial gauge
*2   Peeling speed (wih 180°): 300mm/min., Measuring condition: 23°C Å~65%RH
*3   Leser surface inspection system: Hitachi DEMO(LS5000)
*4   Ion chromatography: 30 minutes boiling in pure water 50ml, and excange extractability to unit weight.