Electronic Process Materials

Because micro-level precision is required for semiconductor devices, delicate handling is essential in the manufacturing process. In the back grinding process in which the back surface of a silicon wafer is ground and the dicing process in which a silicon wafer having microscopic circuit patterns is cut into individual chips, wafer protecting tapes are used extensively. When these processes are completed and the tapes are irradiated with UV rays, the adhesives on these tapes lose tack, enabling the tapes to be easily peeled off. Nitto Denko has developed a number of products to support the use of these tapes including automated tape applicators and comprehensively computer controlled FA systems.

Product data sheets